A very thin silicon chip is bonded to a 6-mm thick aluminum substrate by a 0.02-mm thick epoxy glue. Both surfaces of this chip-aluminum system are cooled by air at 25ºC, where the convective heat transfer coefficient of air flow is 100 W/m^2 . K. If the heat dissipation per unit area from the chip is 10⁴ W/m² under steady-state conditions, draw the thermal circuit for the system and determine the operating temperature of the chip.