In thermal management or cooling of microchip modules for high-powered computer systems, very high heat fluxes have to be accommodated in the design of the cooling method. For many such cases, immersion cooling via pool boiling in a dielectric fluid is often employed [94]. In a pool boiling experiment to evaluate the cooling behavior from a simulated chip module, water is boiled at atmospheric pressure over a submerged emery-polished copper-plate heater. If the surface excess temperature is measured to be 14.5 K, what is the heat flux dissipated by boiling from the copper plate?