Question: (10 pts. total) A computer processor chip requires a range of powers Pelec- The chip is mounted on an insulating board such that all of

(10 pts. total) A computer processor chip requires a range of powers Pelec- The chip is mounted on an insulating board such that all of the power must be conducted out through a heat sink. The heat sink convects heat through a surrounding flow at Tiow = 295 K and radiates heat to surrounding walls at Twall = 295 K. The surface areas of the heat sink that provides heat transfer to the surroundings is Asink = 0.02 m?. The heat sink is made of copper with very high thermal conductivity and can be assumed to be at a single temperature Tsink for a given Pelec. The heat sink has an emissivity Esink = 0.7. The chip has a lower conductivity kchip = 20 Wm1K1. The power Pelec must be conducted through the surface contacting the heat sink, which can be approximated to be at Tsink. The chip area in contact with the heat sink is Achip = 0.002 m? and the chip thickness is Aychip = 0.005 m. a) (4.0 pts) Write an energy balance for the heat sink and code that in a residual function that calculates the energy balance residual. Solve for Tsink over a range of Pelec from 0 to 30 W in increments of 1 W with 5 different convective heat transfer coefficient values: h = 6, 11, 16, 21, 26 W/m?K. For this you will need to set up nested for loops. Comment your for loops and residual function adequately. You must call your residual for each combination of h and Pelec. Plot Tsink Vs. Pelec on separate curves for each h value. (10 pts. total) A computer processor chip requires a range of powers Pelec- The chip is mounted on an insulating board such that all of the power must be conducted out through a heat sink. The heat sink convects heat through a surrounding flow at Tiow = 295 K and radiates heat to surrounding walls at Twall = 295 K. The surface areas of the heat sink that provides heat transfer to the surroundings is Asink = 0.02 m?. The heat sink is made of copper with very high thermal conductivity and can be assumed to be at a single temperature Tsink for a given Pelec. The heat sink has an emissivity Esink = 0.7. The chip has a lower conductivity kchip = 20 Wm1K1. The power Pelec must be conducted through the surface contacting the heat sink, which can be approximated to be at Tsink. The chip area in contact with the heat sink is Achip = 0.002 m? and the chip thickness is Aychip = 0.005 m. a) (4.0 pts) Write an energy balance for the heat sink and code that in a residual function that calculates the energy balance residual. Solve for Tsink over a range of Pelec from 0 to 30 W in increments of 1 W with 5 different convective heat transfer coefficient values: h = 6, 11, 16, 21, 26 W/m?K. For this you will need to set up nested for loops. Comment your for loops and residual function adequately. You must call your residual for each combination of h and Pelec. Plot Tsink Vs. Pelec on separate curves for each h value
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