$2.$ An array of $10$ silicon chips, each of length $\backslash ($ L$=10\backslash$mathrm$\{$~mm$\}\backslash )$ on a side, is insulated on one surface and cooled on the opposite surface by atmospheric air in parallel flow with $\backslash ($ T$\_\{\backslash$infty$\}=20^\{\backslash$circ$\}\backslash$mathrm$\{$C$\}\backslash )$ and $\backslash ($ u$\_\{\backslash$infty$\}=30\backslash$mathrm$\{$~m$\}/\backslash$mathrm$\{$s$\}\backslash ).$ When in use, the same electrical power is dissipated in each chip, maintaining a uniform heat flux over the entire cooled surface. $($: $7\mathrm{.}34,$: $7\mathrm{.}44)$

If the temperature of each chip may not exceed $\backslash (80^\{\backslash$circ$\}\backslash$mathrm$\{$C$\}\backslash ),$ what is the maximum allowable power per chip? What is the maximum allowable power if a turbulence promoter is used to trip the boundary layer at the leading edge? Would it be preferable to orient the array normal, instead of parallel, to the airflow?