Question: 2. Consider the following electron emission type pressure sensor device. It is made by using wafer-bonding technology. The device is finalized by bonding two components

 2. Consider the following electron emission type pressure sensor device. It

2. Consider the following electron emission type pressure sensor device. It is made by using wafer-bonding technology. The device is finalized by bonding two components (emitter membrane to the collecting plate}. Give detailed processing steps of this device

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