Question: 3)A hard-bake process (see Section 5.3.1) is used in conjunction with photolithography in semiconductor manufacturing. We wish to establish statistical control of the flow width

3)A hard-bake process (see Section 5.3.1) is used in conjunction with photolithography in semiconductor manufacturing. We wish to establish statistical control of the flow width of the resist in this process using and R charts. Twenty-five samples, each of size five wafers, have been taken when we think the process is in control. The interval of time between samples or subgroups is one hour. The flow width measurement data (in microns) from these samples are shown in Table. Draw the limits of control charts for future use. To be solved using the excel sheet Wafers Sample Number 2 3 4 5 1 1.3235 1.4128 1.6744 1.4573 1.6914 2 1.4314 1.3592 1.6075 1.4666 1.6109 3 1.4284 1.4871 1.4932 1.4324 1.5674 1.5028 1.6352 1.3841 1.2831 1.5507 1.5604 1.2735 1.5265 1.4363 1.6441 1.5955 1.5451 1.3574 1.3281 1.4198 1.6274 1.5064 1.8366 1.4177 1.5144 1.4190 1.4303 1.6637 1.6067 1.5519 1.3884 1.7277 1.5355 1.5176 1.3688 1.4039 1.6697 1.5089 1.4627 1.5220 1.4158 1.7667 1.4278 1.5928 1.4181 1.5821 1.3355 1.5777 1.3908 1.7559 1.2856 1.4106 1.4447 1.6398 1.1928 1.4951 1.4036 1.5893 1.6458 1.4969 1.3589 1.2863 1.5996 1.2497 1.5471 1.5747 1.5301 1.5171 1.1839 1.8662 1.3680 1.7269 1.3957 1.5014 1.4449 1.4163 1.3864 1.3057 1.6210 1.5573 1.5796 1.4185 1.6541 1.5116 1.7247 1.7106 1.4412 1.2361 1.3820 1.7601 1.4371 1.5051 1.3485 1.5670 1.4880 1.4738 1.5936 1.6583 1.4973 1.4720 1.5295 1.6866 1.5917 1.4333 1.5551 1.6399 1.5243 1.5705 1.5563 1.5530 1.5797 1.3663 1.6240 1.3732 1.6887 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25

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