5 mm by 7 mm rectangular metallic chip and 0.8 mm thick is mounted on a plastic substrate with its front surface cooled by a synthetic liquid flowing over it. Electronic circuits in the back of the chip generate heat at a rate of 10 watts that must be transferred through the chip. The thermal conductivity of silicone is 140 W/(m K). State at least one assumption and determine the following: i) Draw a schematic diagram representing the device set up. (3 marks) ii) Calculate the temperature difference between the front and back surfaces of the chip. (7 marks)