Question: A 0 . 4 m thick rectangular plane wall with a thermal conductivity of 2 0 W / / m * K and thermal diffusivity

A 0.4 m thick rectangular plane wall with a thermal conductivity of 20W//m*K and thermal diffusivity of 5*10^(-6)m^(2)//s is initially at a uniform temperature of 150^(@)C. One side of the wall is
insulated. The other side is suddenly exposed to an environment at 5^(@)C. The convection
coefficient associated with the exposed surface is 100W//m^(2)*K.
In case A, the wall is considered as it is. In case B, the exposed surface of the wall is covered with
a 10 cm thick layer of low-density foam with a thermal conductivity of 0.03W//m*K. For both cases,
the times, t_(1) and t_(2), at which the midpoint in the wall (0.2 m away from the exposed surface)
reaches a temperature of 145^(@)C, and 30^(@)C, respectively, are to be determined.
a) Formulate a solution for time (do not solve) with the following modeling approaches:
i. the lumped capacitance model,
ii.1-term series solution for spatial effects,
iii. 4-term series solution for spatial effects,
iv. semi-infinite solid.
State the common assumptions for all approaches as well as the specific assumptions for
each approach.
b) Determine t_(1) and t_(2) for both cases A and B . For each case and time point, select two
modeling approaches that you consider most appropriate from the options above and
compare the results. Make sure to explain your reasoning for selecting a particular
modeling approach over others.
A 0 . 4 m thick rectangular plane wall with a

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