Question: Dynamic random - access memory ( DRAM ) memory chips are made from silicon wafers in manufacturing facilities through a very complex process called wafer

Dynamic random-access memory (DRAM) memory chips are made from silicon wafers in manufacturing facilities through a very complex process called wafer fabs. The wafers are routed through the fab machines in an order that is referred to as a recipe. The wafers may go through the same machine several times as the chip is created. The data file DRAM Chips contains a sample of processing times, measured in fractions of hours, at a particular machine center for one chip recipe.
Determine what the mode processing time is. Recipe Facility Recipe Desc Processing Duration
FAB C 6030 PZWELL IMP 0.22
FAB C 6030 PZWELL IMP 0.22
FAB C 6030 PZWELL IMP 0.22
FAB C 6030 PZWELL IMP 0.23
FAB C 6030 PZWELL IMP 0.23
FAB C 6030 PZWELL IMP 0.23
FAB C 6030 PZWELL IMP 0.24
FAB C 6030 PZWELL IMP 0.24
FAB C 6030 PZWELL IMP 0.24
FAB C 6030 PZWELL IMP 0.24
FAB C 6030 PZWELL IMP 0.24
FAB C 6030 PZWELL IMP 0.24
FAB C 6030 PZWELL IMP 0.24
FAB C 6030 PZWELL IMP 0.24
FAB C 6030 PZWELL IMP 0.25
FAB C 6030 PZWELL IMP 0.25
FAB C 6030 PZWELL IMP 0.26
FAB C 6030 PZWELL IMP 0.26
FAB C 6030 PZWELL IMP 0.26
FAB C 6030 PZWELL IMP 0.28
FAB C 6030 PZWELL IMP 0.28
FAB C 6030 PZWELL IMP 0.28
FAB C 6030 PZWELL IMP 0.29
FAB C 6030 PZWELL IMP 0.29
FAB C 6030 PZWELL IMP 0.33
FAB C 6030 PZWELL IMP 0.33
FAB C 6030 PZWELL IMP 0.34
FAB C 6030 PZWELL IMP 0.36
FAB C 6030 PZWELL IMP 0.36
FAB C 6030 PZWELL IMP 0.36
FAB C 6030 PZWELL IMP 0.36
FAB C 6030 PZWELL IMP 0.36
FAB C 6030 PZWELL IMP 0.38
FAB C 6030 PZWELL IMP 0.38
FAB C 6030 PZWELL IMP 0.39
FAB C 6030 PZWELL IMP 0.40
FAB C 6030 PZWELL IMP 0.40
FAB C 6030 PZWELL IMP 0.40
FAB C 6030 PZWELL IMP 0.40
FAB C 6030 PZWELL IMP 0.42
FAB C 6030 PZWELL IMP 0.42
FAB C 6030 PZWELL IMP 0.43
FAB C 6030 PZWELL IMP 0.43
FAB C 6030 PZWELL IMP 0.46
FAB C 6030 PZWELL IMP 0.47
FAB C 6030 PZWELL IMP 0.48
FAB C 6030 PZWELL IMP 0.50
FAB C 6030 PZWELL IMP 0.50

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