human errors in scaling, mixing and packing temperature problems in storage and freezers poor quality ingredient received worn or damaged machines incorrect machine settings error detector malfunction poor loading poor driving storage with noxious articles 0 50 100 150 200 250 300 Fig. 3 A fully air-conditioned manufacturing floor to accommodate inspection and testing of semiconductor IC packaging process is known as quality control area. Due to increasing requirement needed for the IC packaging inspection unit per batch for reliability, the manufacturing manager has requested a reliability engineer to conduct risk assessment using FTA at the control room area. This assessment purposely done to avoid high failure numbers of IC's during inspection due to required temperature is not fulfilled. Develop FTA with air conditioning failure as your Top Event. 15