I am trying to make a Linear Tafel Plot representing deposition of copper at the cathode. The system also has a internal ohmic resistance that must be factored into the equation.

(1) Consider metal plating: clectrolytic cell with copper deposition at the cathode and oxygen evolution at the anode. Cu+/CuH2O0=1105A/cm2ETev=+0.40volts;=0.10volts;i0=1105A/cm2Etev=+0.25volts;=0.10volts; (electrode potentials; already corrected for non-unit activities) The anode and cathode are of equal area . h,02,c,Cu,iCAR,EA,EC(1inch=0.2volts;.20to+1.2ontheyaris) (b) Draw the equivalent circuit diagram. Enter the symbolic identifation, numerical value for the voltage or voltage drop, and the polarity for each component . (+X.XX - or X.XX+) (c) Use the loop rule to check (b) for correctness. couretion Ho HOt (1) Consider metal plating: clectrolytic cell with copper deposition at the cathode and oxygen evolution at the anode. Cu+/CuH2O0=1105A/cm2ETev=+0.40volts;=0.10volts;i0=1105A/cm2Etev=+0.25volts;=0.10volts; (electrode potentials; already corrected for non-unit activities) The anode and cathode are of equal area . h,02,c,Cu,iCAR,EA,EC(1inch=0.2volts;.20to+1.2ontheyaris) (b) Draw the equivalent circuit diagram. Enter the symbolic identifation, numerical value for the voltage or voltage drop, and the polarity for each component . (+X.XX - or X.XX+) (c) Use the loop rule to check (b) for correctness. couretion Ho HOt