Place: Quality measured by the defect rate obtained, using nP chart, assume process centered and two-sided specification limit Reject rate 1 in 1000, %, PPM, Yield % Cp Cpk Oven Quality measured by # solder shorts in 10,000 parts, using C chart, assume process centered and two- sided specification limit Nominal 5 shorts/10,000 parts C chart : Cbar UCLC LCLC Reject Rate % , PPM, Yield % Cp Cpk Total Process: Quality measured by all defects in the line of three machines, assume process centered and two sided specification limit Reject Rate %, PPM, Yield % Cp Cpk 7. A PCB assembly line consists of 3 operations: Screen the boards, Place the components and solder the components in an oven. Each operation is described as follows (all operations are presumed done with Operation average = PROCESS Nominal, and the process is 2-sided distribution. Screen: Quality measured by the height of the material deposited, through a control chart Nominal 10 mils_USL_12 No lower limit provided Control Chart : Xdouble bar _10.1 UCLX 11.1 LCLX 9.1 Sample Size 4 Reject Rate %, PPM, Yield % Cp Cpk Place: Quality measured by the defect rate obtained, using P chart with sample average = 100, assume process centered and two-sided specification limit Reject rate 1 in 2,000, %, PPM, Yield % Cp Cpk Oven Quality measured by # solder shorts in 10,000 parts, using C chart, assume process centered and two- sided specification limit Nominal 8 short/10,000 parts C chart : Cbar UCLC LCLC Reject Rate %, PPM, Yield % Cp , Cpk Total Process: Quality measured by all defects in the line of three machines, assume process centered and two sided specification limit Reject Rate %, PPM, Yield % Cp Cpk MECH.5710 QE Final Exam. - SU19 Page 9/10