Question: Problem 1 : Data was collected for the thermal conductivity [ W / m - K ] of a silicon wafer at different temperatures [
Problem :
Data was collected for the thermal conductivity WmK of a silicon wafer at
different temperatures K The data is shown in the table below.
K
WmK
Write a script program that addresses the following features:
a Assign the data as row vectors to the variables Texp and kexp, respectively.
b Compute the natural log of both Texp and kexp. Then, create a plot of ln vs ln as
black circles for the data points. Include a title and axis labels.
iConcept By looking at the plot, comment on the relationship between ln vs ln
How does it differ from what you might expect the relationship to be Why?
c Using the natural log data from part b proceed to assume a power fit model. You can use the
leastsquares method explicitly as shown and coded in class or use the polyfit command.
iConcept Use the values of the found coefficients from the model to write an equation for
the thermal conductivity as a function of the natural logarithm of temperature ln
Show all your typed work to derive this equation from the model.
d Repeat part c but modify the power fit model to use a quadratic fit on the data from part b
instead of the linear fit that a conventional power fit model uses.
e Use each of the assumed models in parts c and d to compute the predicted values for thermal
conductivity. Assign the results to the variables kpower and kpower respectively.
f Create a second plot of the: data from part aas black asterisk points predicted values in
kpower from part eas a red dashed line and predicted values in kpower from part e
as a blue dashed line Add a title, axis labels, a legend. Use axis
iConcept Determine the sum of squares of the residual error
# for each of the
assumed models. Compare and comment on their accuracy. Which one is more accurate?
BONUS: Use numerical differentiation to compute most accurately the conductive gradient
relative to temperature of the original data from part a Save the temperature data Texp,
thermal conductivity data kexp, and in a mat file named dkdTmat.
Submit the script code in your report, typed responses to concept questions, and screenshots
of each plot.
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