Question: Problem 2: A TiW layer is deposited on a substrate using a sputtering tool. Table below contains layer thickness measurements (in angstroms) on 20 subgroups

Problem 2: A TiW layer is deposited on a

Problem 2: A TiW layer is deposited on a substrate using a sputtering tool. Table below contains layer thickness measurements (in angstroms) on 20 subgroups of four substrates. Subgroup X X2 X3 X4 435 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 459 443 457 469 443 444 445 446 444 432 445 456 459 441 460 453 451 422 444 450 449 440 444 463 457 456 449 455 452 463 452 457 445 465 453 444 460 431 446 450 442 449 453 445 456 450 449 457 463 453 436 441 438 457 451 450 437 448 454 450 442 444 438 454 457 445 452 440 443 438 457 447 450 438 435 457 429 467 454 (a) Setup X and R control charts on this process. Is the process in control? Revise the control limits as necessary. (b) Estimate the mean and standard deviation of the process. (c) Is the process in control? (d) Suppose that following the construction of the x and R control charts in part (a), the process engineers decided to change the subgroup size to n = 2. Evaluate the new control limits for n = 2

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