Question: Question 1 A CPU chip of a computer is being cooled by circulating water under vacuum through a cooling plate attached to the chip. The
Question
A CPU chip of a computer is being cooled by circulating water under vacuum through a cooling plate attached to the chip. The water boils on the chip and the vapor generated is fed to a condenser, where the vapour is condensed on a vertical plate heat exchanger. The condensed water is then fed back to the CPU chip.
The system is operated at a system saturation temperature of circmathrmC
The surface roughness of the CPU is approximately Rp o l d of mu mathrm~m
The CPU chip should not operate at a temperature of above circmathrmC and it has a maximum power output of mathrm~kWmathrmm and this set of conditions is thus the worstcase design condition for the boiling surface. The cooling plate attached to the chip is tmathrm~mm thick and is a square with sides of mm and is made of pure aluminium.
a What is heat transfer coefficient expected on the boiling surface within the cooling chip under these worstcase design conditions?
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b How close to the critical heat flux is the boiling surface operating atie Express this operating condition as a percentage of the critical heat flux
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c What is the vapour generation rate as a result of boiling under these worstcase design conditions?
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d What is the average condensation heat transfer coefficient on each of the condensation plates?
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e How many vertical plates would be needed in the condenser to condense all the vapour generated by the CPUs, if there are CPUs and they are all connected to the same condenser The plates are illustrated in Figure
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f The design engineer is considering using a zeotropic fluid in this system. What is zeotropic fluid, and how would it effect the boiling process?
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The condenser has a series of vertical plates H that are mm high and mm long and maintained at a temperature Tc of circmathrmC by an internal coolant, as shown in Figure
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