The specs indicate that the bottom of the module should be at 80C for proper functioning,...

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The specs indicate that the bottom of the module should be at 80°C for proper functioning, otherwise, the module time life decays exponentially. The OEM tells the thermal team that the module is going to be mounted on an aluminum plate with the same dimensions as the footprint of the module and a 1 cm thickness. The Fortimo LED HBMt 6000/840 46W Gen3 module used has an efficiency of 50%, which means that out of the 46 W of the input electrical power, 23 W is dissipated as heat. Assuming that all the heat dissipated is 1-d conducted towards the plate as shown in the picture and finally towards the air. For your design neglect all the heat transfer towards the upper part of the module and side parts of the assembly due to convection and radiation. Problem: ● Fortimo HBM ● Aluminium plate ● 80 °C The quality department banned the use of silicon thermal due to contamination of the module with thermal paste. You have to propose 3 different options to replace the thermal paste. Options: thermal pads, Thermal tapes, Phase change materials, etc. Perform the calculations for your proposal, also add the calculation if no material at the interface is used. Recommended procedure: Air, forced convection, HTC=100 W/m²°C, Tair =23 °C Sketch the thermal network with the known values. Choose a thermal interface material TIM, from the supplier investigate the thermal resistance (see useful sources). It is required to indicate the reference where are you taking the information. ● Calculate the unknown thermal resistances. Verify if the thermal dissipation using your proposed TIM is OK with the requirement. Repeat the procedure for your three proposed TIMS Contact thermal resistance The specs indicate that the bottom of the module should be at 80°C for proper functioning, otherwise, the module time life decays exponentially. The OEM tells the thermal team that the module is going to be mounted on an aluminum plate with the same dimensions as the footprint of the module and a 1 cm thickness. The Fortimo LED HBMt 6000/840 46W Gen3 module used has an efficiency of 50%, which means that out of the 46 W of the input electrical power, 23 W is dissipated as heat. Assuming that all the heat dissipated is 1-d conducted towards the plate as shown in the picture and finally towards the air. For your design neglect all the heat transfer towards the upper part of the module and side parts of the assembly due to convection and radiation. Problem: ● Fortimo HBM ● Aluminium plate ● 80 °C The quality department banned the use of silicon thermal due to contamination of the module with thermal paste. You have to propose 3 different options to replace the thermal paste. Options: thermal pads, Thermal tapes, Phase change materials, etc. Perform the calculations for your proposal, also add the calculation if no material at the interface is used. Recommended procedure: Air, forced convection, HTC=100 W/m²°C, Tair =23 °C Sketch the thermal network with the known values. Choose a thermal interface material TIM, from the supplier investigate the thermal resistance (see useful sources). It is required to indicate the reference where are you taking the information. ● Calculate the unknown thermal resistances. Verify if the thermal dissipation using your proposed TIM is OK with the requirement. Repeat the procedure for your three proposed TIMS Contact thermal resistance