Advanced MEMS Packaging(1st Edition)

Authors:

John Lau, Cheng Lee, C. Premachandran, Yu Aibin

Type:Hardcover/ PaperBack / Loose Leaf
Condition: Used/New

In Stock: 1 Left

Shipment time

Expected shipping within 2 - 3 Days
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Book details

ISBN: 0071626239, 9780071626231

Book publisher: McGraw-Hill Professional Publishing

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