Question: Computer chips (Fig. 1-17) are etched on circular silicon wafers of thickness 0.300 mm that are sliced from a solid cylindrical silicon crystal of length

Computer chips (Fig. 1-17) are etched on circular silicon wafers of thickness 0.300 mm that are sliced from a solid cylindrical silicon crystal of length 25 cm. If each wafer can hold 400 chips, what is the maximum number of chips that can be produced from one entire cylinder?

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