Figure 2.15 shows an arrangement for cooling of an electronic equipment consisting of a number of printed

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Figure 2.15 shows an arrangement for cooling of an electronic equipment consisting of a number of printed circuit boards (PCB) enclosed in a box. Air is forced through the box by a fan. Select a typical element and write down the stiffness matrix and show that this method can take care of nonuniform flow (by using the methodology similar to the problem 4, the nonuniform flow in each channel can be determined) and nonuniform heat generation in individual PCB.

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