To determine optimum condition for a circuit board, the effects of bond strength of FR-4 (an insulating substrate) and thickness of copper lamination on the current flow are studied in a \(2 \times 5\) factorial experiment. The results of three replicates are as follows:

Analyze these results and determine the circuit board condition or conditions that produce the highest current flow. Also construct a \(99 \%\) confidence interval for the current flow of the board corresponding to these optimum conditions.

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Bond Strength Thickness of copper Current flow FR-4 (kg) lamination (micrometers) Rep. I Rep. 2 Rep. 3 1000 104 52 59 54 1000 108 48 52 52 1000 112 46 50 50 1000 116 42 48 42 1000 120 34 42 38 1250 104 68 78 75 1250 108 66 70 71 1250 112 60 74 72 1250 116 64 69 1250 120 54 65 955 66 61