Pull-strength tests on 10 soldered leads for a semiconductor device yield the following results, in pounds of force required to rupture the bond:

0.01 1 2 0.01 1 2 0.05 1 2 0.95 1 2 0.99 1 2 Another set of 8 leads was tested after encapsulation to determine whether the pull strength had been increased by encapsulation of the device, with the following results:

Comment on the evidence available concerning equality of the two population variances.