Pull-strength tests on 1D soldered leads tor a semiconductor device yield the results provided in the accompanying data set (Sample 1], in pounds offorce required to rupture the bond. Another set of 8 leads was tested alter encapsulation to determine whether the pull strength had been increased by encapsulation of the device. with the results also provided in the accompanying data set (Sample 2). Comment on the evidence available concerning equality ofthe hvo population variances. Click here to view the data set. Click here to view page 1 of the table of critical values 01 the tdistlibution, tor alpha = 1101. Click here to view page 2 of the table of critical values 01 the tdistlibution, tor alpha = 1101. Click here to view page 1 of the table of critical values of the tdistn'bution, tor alpha = 8.05. Click here to view page 2 of the table of critical values 01 the tdistlibution, tor alpha = 1105. The computed ivalue with v1: 9 and v2: 7 degrees of freedom is f= -. Since P(F>'f} is (Round to two decimal places as needed.) between 0.01 and 0.05, the variances be equal. Final grades Sample 1 Sample 2 10.1 20.4 19.8 20.2 13.7 23.2 14.7 21.6 15.8 21].? 18.8 22.7 10.7 23.3 15.8 24.1 15.7 19.8