2 and 4 please and thank you :)

Question 2 (3): a) If we want to deposit a metal film on a substrate by resistance heated evaporation (as opposed to e- beam), what kind of metals are preferred in terms of melting point and vapor pressure? b) Does the restriction in (a) for the preferred metals also hold for e-beam evaporation? c) How is the thickness of a deposited thin film measured during evaporation? Question 4 (10): Make a detailed comparison of sputtering versus evaporation as the two commonly used PVD deposition methods, listing the advantages and disadvantages of each