Question: a silicon wafer has been etched through a square window opening of size 10microm*10microm in the oxide layer. Draw cross sectional profiles and mark all

a silicon wafer has been etched through a square window opening of size 10microm*10microm in the oxide layer. Draw cross sectional profiles and mark all the dimensions of the etched silicon for the following cases:

(a) the chemical is isotropic etchant, wafer is <100> silicon, etch depth is 5 micrometer.

(b) Etchant is 30% KOH solution, wafer is <100> silicon, etch depth is 5 micrometer.

(d) Anisotropic etchant, wafer is <110> silicon, etch depth is 10 micrometer.

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