A thin sliced silicon chip is sandwhiched between two$-5$mm thick aluminum substrates $($k$=240$ W$/$m$*$K$),$ Each with a surface area of $\mathrm{.}0004$ m$^2.$ The top and bottom surfaces of substrates are exposed to air, where heat is dissipated through convection. The thermal contact resistance between the silicon chip and each substrate is Rc$=\mathrm{.}003$ K$/$W$,$ and the chips temperature is assumed to be uniform. The silicone chip dissipates $10$ W of heat under steady$-$state conditions, and the maximum aloowable temperature for the chip is $100$ degrees C$.$ Radiation heat transfer is considered negligble.

A$)$draw a thermal circuit to show the heat flow from the chip to the surrounding air

B$)$determine whether the silicon chip can operate under the given conditions

C$)$determine the top surface temperature of the supper substrate, Ts$1,$ with precision to the hundredth place