Useful I data: Y = C/ C 1.4 Gas Molar mass- M-, kg/k mol Air 28.97...

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Useful I data: Y = C/ C 1.4 Gas Molar mass- M-, kg/k mol Air 28.97 32 1.4 охудen Butane (C,H10) Nitrogen (N2) Methane (CH) 58 1.1 28 1.4 16 1.32 Universal gas constant = 8.314 kJ / kmol. K 1 bar = 100 kPa For liquid water h = 4.18 *t, kJ/kg where t in °C Water density 1000 kg/m 14- A thin silicon chip and an 8-mm-thick aluminum substrate are separated by 0.02-mm-thick epoxy joint. The chip and substrate are each 10 mm on a side, and their exposed surfaces are cooled by air, which is at a temperature of 25 °C and provides a convection heat transfer coefficient of 100 W/m K. if the chip dissipates 10* W/ m? under normal operating conditions, will it operate below a maximum allowable temperature of 85 °C For aluminum k = 239 W/m K, for epoxy k = 0.22 W/m K T- 25°C h = 100 W/m2-K Air Insulation Silicon chip Ероху јoint (0.02 mm) L=8 mm Aluminum- substrate T= 25°C h = 100 W/m2-K Air Useful I data: Y = C/ C 1.4 Gas Molar mass- M-, kg/k mol Air 28.97 32 1.4 охудen Butane (C,H10) Nitrogen (N2) Methane (CH) 58 1.1 28 1.4 16 1.32 Universal gas constant = 8.314 kJ / kmol. K 1 bar = 100 kPa For liquid water h = 4.18 *t, kJ/kg where t in °C Water density 1000 kg/m 14- A thin silicon chip and an 8-mm-thick aluminum substrate are separated by 0.02-mm-thick epoxy joint. The chip and substrate are each 10 mm on a side, and their exposed surfaces are cooled by air, which is at a temperature of 25 °C and provides a convection heat transfer coefficient of 100 W/m K. if the chip dissipates 10* W/ m? under normal operating conditions, will it operate below a maximum allowable temperature of 85 °C For aluminum k = 239 W/m K, for epoxy k = 0.22 W/m K T- 25°C h = 100 W/m2-K Air Insulation Silicon chip Ероху јoint (0.02 mm) L=8 mm Aluminum- substrate T= 25°C h = 100 W/m2-K Air