Please use minitab

The data represents the copper concentration in a plating process. Copper concentration in a plating pool is controlled by an automated colorimeter that takes readings and adjusts the concentration as required. To verify the correct functioning of a new colorimeter system, copper concentration is measured manually six times per shift. (3) Plot an x-bar and R control chart for this process. Perform runs tests to Western Electric rules 1 through 5 in Table 5.1, p. 205 of the textbook. Is the process in control? Revise the control limits as necessary. (b) Estimate the mean and standard deviation of the revised process. (c) Is the layer thickness of the revised process normally distributed? (d) If the specications are 9.0 i 2.0 ppm, estimate the process capability. C11 C11 Cu Cu Cu Subgroup 1315111 Subgroup 1113111 Subgroup Epm Subgroup ppm Subgroup 1315111 1 3.69 5 10.06 9 9.33 13 9.66 17 9.70 l 3.52 5 9.93 9 9.03 13 9.10 17 9.22 1 9.24 5 9.32 9 7.36 13 9.04 17 9.24 1 3.96 5 9.33 9 9 .24 13 9.64 17 9.34 1 10.01 5 10.06 9 3.43 13 9.36 17 3.70 1 3.63 5 9.36 9 3 .63 13 3.62 17 9.30 2 3.46 6 9.50 10 9.33 14 9.32 13 9.16 2 3.34 6 9.33 10 3.12 14 9.14 13 9.34 2 3.90 6 9.00 10 7.93 14 3.30 13 9.20 2 9.23 6 9.33 10 3.72 14 9.54 13 9.14 2 3.34 6 3.96 10 3.66 14 9.33 13 9.42 2 9.24 6 3.74 10 9.33 14 9.33 13 3.33 3 3.32 7 9.04 11 9.13 15 9.12 19 9.14 3 9.46 7 9.23 11 9 .23 15 9.94 19 9.06 3 3.30 7 3.03 11 9.33 15 3.54 19 9.40 3 9.33 7 9.42 11 9.46 15 9.12 19 9.66 3 9.23 7 3.72 11 9.34 15 9.33 19 9.43 3 9.14 7 3.72 11 9.53 15 9.36 19 3.32 4 3.74 3 9.24 12 9 .36 16 9.04 20 9.44 4 3.66 3 9.32 12 9.30 16 9.92 20 9.33 4 9.26 3 9.14 12 9.32 16 9.32 20 9.24 4 9.26 3 3.92 12 9 .30 16 3.63 20 3.30 4 9.00 3 3.32 12 9 .00 16 9. 30 20 9.42 4 9.03 3 10.13 12 9.06 16 9.46 20 9.70