Project 3: Thermal Fatigue of Solder Interconnects Group#: What happens to an electronic package when it...
Fantastic news! We've Found the answer you've been seeking!
Question:
Transcribed Image Text:
Project 3: Thermal Fatigue of Solder Interconnects Group#: What happens to an electronic package when it is subjected to repeated temperature changes? This question is important if you want your electronic product to be reliable. Every time you use your cell phone, pager, computer, or start your car, the electronics inside begin to warm up. When materials warm up, they expand. However, different materials expand at different rates. For example, the glass-epoxy laminate, called a printed circuit board (PCB), has a coefficient of thermal expansion (CTE) of 12 to 15 x 10-K, while the silicon integrated circuit located inside an electronic package has a CTE equal to 2.5 x 10-"K-1. These differences will induce inelastic deformation to the solder interconnect. The solder interconnect makes the electrical connection from the PCB to the electronic package and is usually made of a low melting- point (183°C) alloy comprised of tin and lead. After using your portable product or computer or turning the car engine off, the electronics will cool off. These temperature cycles result in repeated expansion and contraction of the material used to make the electronic assemblies. The greater the temperature change or the greater the difference in CTE between materials, the greater will be the inelastic strain imparted to the solder joint. A decrease in strain will increase fatigue life. Let's look at a typical situation. Solder Joint Strain, ep Fatigue Cycles, Nf 0.009 10,000 0.031 1000 0.13 100 0.42 10 1.61 1 X Using the experimental fatigue life data given in the table, answer the questions below. Show your work in the provided area when applicable. When you need to graph, use only the graph paper on the back. Choose a linear scale along the axes, and chose a "graph window" appropriate to each graph. Use a ruler to draw the axes and label them clearly. 1. Draw a scatter diagram of the data with solder joint strain as the independent variable. y 2. Let x-In(ep). Show your transformed data and draw a scatter diagram with x as the independent variable and fatigue cycles as the dependent variable. What happens to the shape of the scatter diagram? 3. Let y-In(N). Show your transformed data and draw a scatter diagram with x as the independent variable and y as the dependent variable. What type of relation would best describe the data? 4. Find the line of best fit to the transformed data using a graphing utility. Graph the line of best fit on the scatter diagram drawn in problem 3. Line of best fit: 5. Use the equation from problem 4 to find real numbers r and x to express Nf as a function of rp in the form Nf= r(ep)'. Nf= 6. If the solder joint strain is 0.025, what is the expected fatigue life? Answer: 7. (a) Express the inelastic solder joint strain as a function of the fatigue life by computing the inverse of the function from problem 5. (b) Use it to compute the solder joint strain when the fatigue life equals 3500 cycles. (a) Answer: (b) Answer: Project 3: Thermal Fatigue of Solder Interconnects Group#: What happens to an electronic package when it is subjected to repeated temperature changes? This question is important if you want your electronic product to be reliable. Every time you use your cell phone, pager, computer, or start your car, the electronics inside begin to warm up. When materials warm up, they expand. However, different materials expand at different rates. For example, the glass-epoxy laminate, called a printed circuit board (PCB), has a coefficient of thermal expansion (CTE) of 12 to 15 x 10-K, while the silicon integrated circuit located inside an electronic package has a CTE equal to 2.5 x 10-"K-1. These differences will induce inelastic deformation to the solder interconnect. The solder interconnect makes the electrical connection from the PCB to the electronic package and is usually made of a low melting- point (183°C) alloy comprised of tin and lead. After using your portable product or computer or turning the car engine off, the electronics will cool off. These temperature cycles result in repeated expansion and contraction of the material used to make the electronic assemblies. The greater the temperature change or the greater the difference in CTE between materials, the greater will be the inelastic strain imparted to the solder joint. A decrease in strain will increase fatigue life. Let's look at a typical situation. Solder Joint Strain, ep Fatigue Cycles, Nf 0.009 10,000 0.031 1000 0.13 100 0.42 10 1.61 1 X Using the experimental fatigue life data given in the table, answer the questions below. Show your work in the provided area when applicable. When you need to graph, use only the graph paper on the back. Choose a linear scale along the axes, and chose a "graph window" appropriate to each graph. Use a ruler to draw the axes and label them clearly. 1. Draw a scatter diagram of the data with solder joint strain as the independent variable. y 2. Let x-In(ep). Show your transformed data and draw a scatter diagram with x as the independent variable and fatigue cycles as the dependent variable. What happens to the shape of the scatter diagram? 3. Let y-In(N). Show your transformed data and draw a scatter diagram with x as the independent variable and y as the dependent variable. What type of relation would best describe the data? 4. Find the line of best fit to the transformed data using a graphing utility. Graph the line of best fit on the scatter diagram drawn in problem 3. Line of best fit: 5. Use the equation from problem 4 to find real numbers r and x to express Nf as a function of rp in the form Nf= r(ep)'. Nf= 6. If the solder joint strain is 0.025, what is the expected fatigue life? Answer: 7. (a) Express the inelastic solder joint strain as a function of the fatigue life by computing the inverse of the function from problem 5. (b) Use it to compute the solder joint strain when the fatigue life equals 3500 cycles. (a) Answer: (b) Answer:
Expert Answer:
Answer rating: 100% (QA)
1 Scatter Dagram with solder strain as independent variable solder joint Strain ep w... View the full answer
Related Book For
Applied Statistics and Probability for Engineers
ISBN: 978-1118539712
6th edition
Authors: Douglas C. Montgomery, George C. Runger
Posted Date:
Students also viewed these physics questions
-
Chromalox Instruments and Controls, located in LaVergne, Tennessee, is a manufacturer of industrial process controllers, monitors, and industrial and military control panels. Chromalox products are...
-
Planning is one of the most important management functions in any business. A front office managers first step in planning should involve determine the departments goals. Planning also includes...
-
Managing Scope Changes Case Study Scope changes on a project can occur regardless of how well the project is planned or executed. Scope changes can be the result of something that was omitted during...
-
A ball of mass 0.440 kg moving east( + x direction) with a speed of 3.30m/s collides head-on with a 0.220-kg ball at rest. If the collision is perfectly elastic, what will be the speed and direction...
-
If the bond has a sinking fund that requires the firm to set aside annually with a trustee sufficient funds to retire the entire issue at maturity, how much must the firm remit each year for 10 years...
-
Audrey Martin and Beth James are partners in the Country Gift Shop, which employs the individuals listed below. Paychecks are distributed every Friday to all employees. Based on the information...
-
Dearborn Manufacturing Co. completed the following transactions during 2009 . Requirement Record the transactions in Dearborn's general journal. Jan. 16 Declared a cash dividend on the 4%, $100 par...
-
Air at a flow rate of 12,000 scfm (60?F, 1 atm) and containing 0.5 mol% ethyl acetate (EA) and no water vapor is to be treated with activated carbon (C) (?b = 30 lb/ft3) with an equivalent particle...
-
Put the following parts of a letter in the proper order ( from the 1st line to the last line) that they should be written to create the most effective message. 1.Dear Ms. Knot: 2.Please enclose an...
-
The International Lodging Merger Role of AAA Hotels Executive Committee, discuss the major negotiation point between the two hotels and how to gain a result from the AAA Hotels point of view. How to...
-
(9) Write useful contrapositives of the following sentences. Express the contrapositives as sentences, not as symbolic expressions. Reword, if necessary, to clarify the meaning of review e...
-
A $1,000 par value 10-year bond with annual coupons is redeemable at $1,055, and has a purchase price of $986 at a yield rate of 4% per annum. The coupons are non-level and increase by $2 per year....
-
Martians wants a program to help them analyze the soil on Mars. They want to determine the best areas to grow crops. You will write a program that will accept, at the command line, two Strings, one...
-
3 Growth Model Suppose that output (Y) in an economy is given by the following aggregate production function: Y = K+N where K, is capital and N, is the population. Furthermore, assume that capital...
-
A motor is spinning with angular w = 5000 rpm as shown in Figure 1. a) Using manual calculation, determine the precession velocity of the mechanism when a mass, m=0.15 kg is attached at point C with...
-
The capital accounts of Hassan Khan and Dmitri Palovich have balances of $110,000 and $78,000, respectively, on January 1, 2014, the beginning of the fiscal year. On July 10, Khan invested an...
-
provide insight and explanation of these table ? 2.2.1 Analysis #1: Independent T-test Level of Health Consciousness Male Female n = 137 Mean = 5.528 n = 135 Mean = 5.380 Std Dev. = 0.7684 Std Dev....
-
In the current year, the City of Omaha donates land worth $500,000 to Ace Corporation to induce it to locate in Omaha and create an estimated 2,000 jobs for its citizens. a. How much income, if any,...
-
Assume that each of your calls to a popular radio station has a probability of 0.02 of connecting, that is, of not obtaining a busy signal. Assume that your calls are independent. (a) What is the...
-
Construct a histogram for the female student height data in Exercise 6-38. Data from 6-38 62 64 61 67 65 68 61 65 60 65 64 63 59 65 67 62 66 68 67 66 65 67 65 68 64 66 68 69 69 65 69 65 67 67 65 63 4...
-
The January 1990 issue of Arizona Trend contains a supplement describing the 12 best golf courses in the state. The yardages (lengths) of these courses are as follows: 6981, 7099, 6930, 6992, 7518,...
-
Consider the common-base circuit in Figure 7.33 in the text. The transistor parameters are \(\beta=90, V_{E B}(\mathrm{on})=0.7 \mathrm{~V}\), and \(V_{A}=\infty\). A load capacitance of \(C_{L}=3...
-
For the circuit in Figure P7.39, the transistor parameters are: \(K_{n}=\) \(0.5 \mathrm{~mA} / \mathrm{V}^{2}, V_{T N}=2 \mathrm{~V}\), and \(\lambda=0\). Determine the maximum value of \(C_{L}\)...
-
Consider the circuit shown in Figure 7.25(a). The bias voltages are changed to \(V^{+}=3 \mathrm{~V}\) and \(V^{-}=-3 \mathrm{~V}\). The load resistor is \(R_{L}=20 \mathrm{k} \Omega\). The...
Study smarter with the SolutionInn App