The surface of copper gets tarnished by the formation of copper oxide. N gas was passed...

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The surface of copper gets tarnished by the formation of copper oxide. N gas was passed to prevent the oxide formation during heating of copper at 1250 K. However, the N gas contains 1 mole % of water vapour as impurity. The water vapour oxidises copper as per the reaction given below: 2Cu(s) + HO(g) CuO(s) + H(g) PH is the minimum partial pressure of H (in bar) needed to prevent the oxidation at 1250 K. The value of In (P) is (Given: total pressure = 1 bar, R (universal gas constant) = 8 J K mol, In(10) = 2.3. Cu(s) and CuO(s) are mutually immiscible. At 1250 K: 2Cu(s) + O(g) CuO(s); AG-78,000 J mol- H(g) + 1/2O(g) HO(g); AG = -1,78,000 J mol G is the Gibbs energy) The surface of copper gets tarnished by the formation of copper oxide. N gas was passed to prevent the oxide formation during heating of copper at 1250 K. However, the N gas contains 1 mole % of water vapour as impurity. The water vapour oxidises copper as per the reaction given below: 2Cu(s) + HO(g) CuO(s) + H(g) PH is the minimum partial pressure of H (in bar) needed to prevent the oxidation at 1250 K. The value of In (P) is (Given: total pressure = 1 bar, R (universal gas constant) = 8 J K mol, In(10) = 2.3. Cu(s) and CuO(s) are mutually immiscible. At 1250 K: 2Cu(s) + O(g) CuO(s); AG-78,000 J mol- H(g) + 1/2O(g) HO(g); AG = -1,78,000 J mol G is the Gibbs energy)

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