Question: Which step in the bottleneck? A. Surface mounting B. All three steps C. Baking D. Final assembly What is the capacity utilization of the surface
Which step in the bottleneck?
| A. | Surface mounting | |
| B. | All three steps | |
| C. | Baking | |
| D. | Final assembly |
What is the capacity utilization of the surface mounting step ?
| A. | 3% | |
| B. | 60% | |
| C. | 80% | |
| D. | 100% |
. What is the average idle time for the final assembly step during the production of a batch of PCBs?
| A. | 2 min | |
| B. | 4 min | |
| C. | 0 min | |
| D. | 190 min |
10. To increase the production capacity of circuit boards, in which step you should increase the capacity ?
| A. | Final assembly | |
| B. | Baking | |
| C. | All three steps | |
| D. | Surface mounting |
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