Question: Which step in the bottleneck? A. Surface mounting B. All three steps C. Baking D. Final assembly What is the capacity utilization of the surface

Which step in the bottleneck?

A.

Surface mounting

B.

All three steps

C.

Baking

D.

Final assembly

What is the capacity utilization of the surface mounting step ?

A.

3%

B.

60%

C.

80%

D.

100%

. What is the average idle time for the final assembly step during the production of a batch of PCBs?

A.

2 min

B.

4 min

C.

0 min

D.

190 min

10. To increase the production capacity of circuit boards, in which step you should increase the capacity ?

A.

Final assembly

B.

Baking

C.

All three steps

D.

Surface mounting

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