Traditionally, solders used in electronics assembly are made with lead. Due to numerous environmental hazards associated with lead solders (e.g., groundwater contamination and breathing in of fine lead-bearing particles), engineers are developing lead-free solders. In Soldering & Surface Mount Technology (Vol. 13, 2001), researchers compared the traditional tin–lead alloy solder to three lead-free alloys: tin–silver, tin–copper, and tin–silver–copper. A measure of plastic hardening (Nm/m2) was obtained for each solder type at each of six different temperatures. The data are given in the table.

a. Explain why the data should be analyzed using a randomized block design ANOVA.

b. Form a summary ANOVA table for the analysis.

c. Do you detect differences in the mean plastic hardening values for the four solder types? Test using α = .10.

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LEADSOLDER Tin-Silver- Temperature Tin-Lead Tin-Silver Tin-Copper copper 23°C 50.1 33.0 14.9 41.0 50°C 24.6 27.7 10.5 20.7 75°C 23.1 10.7 9.3 17.1 100°C 1.8 9.0 8.8 8.7 125°C 1.1 4.9 5.4 7.1 150°C 0.3 3.2 5.0 4.9