Consider the requirements of a low dielectric constant, low dielectric loss, good mechanical strength, and high thermal

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Consider the requirements of a low dielectric constant, low dielectric loss, good mechanical strength, and high thermal conductivity for electronic packaging substrates. What materials would you consider?

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The Science And Engineering Of Materials

ISBN: 9781305076761

7th Edition

Authors: Donald R. Askeland, Wendelin J. Wright

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Question Posted: Aug 30, 2022 02:35 AM

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Consider the requirements of a low dielectric constant, low dielectric loss, good mechanical strength, and high thermal

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In SI units thermal conductivity is expressed in watts per meter kelvin whereas in imperi...View the full answer

The Science And Engineering Of Materials

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