What are the advantages of surface mount technology and through-hole (or pin-in-hole) technology for attachment of IC

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What are the advantages of surface mount technology and through-hole (or pin-in-hole) technology for attachment of IC packages and discrete electrical components to boards?

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Materials and process in manufacturing

ISBN: 978-0471656531

9th edition

Authors: E. Paul DeGarmo, J T. Black, Ronald A. Kohser

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Question Posted: May 24, 2016 06:33 AM

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What are the advantages of surface mount technology and through-hole (or pin-in-hole) technology for attachment of IC

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In throughhole connections discrete electronic components ...View the full answer

Materials and process in manufacturing

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