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engineering
materials science engineering

Questions and Answers of Materials Science Engineering

Why was it necessary for machine tool builders to improve the lead screws on their machines when they made them into NC machines?
Explain what is meant by interpolation in NC programming.
Explain the problem of cutter offset in NC programming, using Figure 32-A with a ^-in. diameter cutter end milling on the bottom and right side.
Some of the functions performed by the operator in piece-part manufacturing are very difficult to automate completely. Name the functions and explain why.
The first NC machines were closed-loop control. Later some machines were open loop. What change did this require on the part of machine tool builders?
Can a continuous-path NC machine be open loop? Why or why not?
Why isn't manual programming used for continuous-path NC?
Give an everyday example of a household device or appliance that exhibits automation levels A(1), A(2), A(3), and A(4).
What is the difference between the zero reference point and the machine zero point?
Why does contouring require both velocity and positional feedback?
What is pocket milling, and what kind of milling cutter is usually used to perform it?
How are probes used in CNC machines to improve process capability?
What are G words used for in NC?
Flexible manufacturing systems use CNC machines for processing and AGVs, robots, or conveyors to transport parts. What differentiates the FMS from a transfer line?
Why do you think that transfer lines are using more programmable machines and PLCs?
A standard piece of CAD analysis is called FEA. What does a finite element analysis do?
Explain how a windmill is an A(4) device or machine (i.e., self-adjusting).
What is the difference between the two types of CAPP?
The A(6) level tries to relate causes to effect using AI. What is AI?
What are the main areas in which robots are being utilized in industry today?
What are the basic components of all robots?
How is positional feedback obtained in robots?
Compare a rotary transfer machine with an unmanned robotic cell.
Compare a human worker in a manned cell to the robotic worker in the unmanned cell. What are the advantages of one over the other?
The vast majority of robots are used in automobile fabrication for welding and painting. Why?
What device in the typical modern bathroom has a feedback control device in it?
What are the major changes that are being introduced into UHSMCs?
In terms of a transfer line, explain what is meant by line balancing. Discuss using the rotary transfer line.
How is a machining center different from a milling machine?
What role did John Parsons play in the development of NC?
What was DNC as first practiced, and what does DNC usually mean today?
How does an adaptive control system differ from a numerical control system?
Configurations obtained from continuous-path machining are the result of a series of straight-line, parabolic-span or higher-order curves. The degree to which curved surfaces correspond to their
In Problem 2, suppose that the acceptable tolerance was 0.0001 in. Determine the span angle.
Suppose that the plate shown in Figure 32-B was to be profile milled around the periphery with a l-in.-diameter end-milling cutter. The dashed line is the cutter path. The programmer must calculate
Suppose that surface finish is very important for the profile milling job described in Problem 4. Thus downmilling is going to be used. Rewrite the NC program points to accommodate this requirement.
An example of how the APT language would be used on a part is shown in Figure 32-35. Essentially, it is necessary to tell the computer the location of a center of the bolt hole circle or one of the
Table 32-A gives the Arabic and comparative binary numbers. The number 182 is expressed in Arabic thus as:In binary, the number 182 is 10110110. Show how this is obtained.
You have received the part drawing for a typical lathe part that will require turning, facing, grooving, boring, and threading as it is machined from a casting. See Figure 32-D. Unfortunately, you do
An underground steam line for a military base in Alaska, approximately 1.6 km (1 mile) in length, used the units depicted in Figure CS-32, each unit being 9.14 m (30 ft) in length. As shown, the
How do the capabilities of FF processes in general compare with those of material removal processes such as turning?
What does the term tessellation mean, and what is it used for?
What does preprocessing involve in FF processes? What does postprocessing involve?
Of the three components of build time in FF processes, which tends to be the longest? Why?
What is a voxel? Why is it significant in FF processing?
What is the most dominant surface effect caused by FF processes? How can this effect be minimized?
What is random noise shrinkage, and why is it a factor in de-termining the dimensions of prototypes produced in FF processes? What is the implication of the random noise shrinkage?
According to Table 33-2, which material would be most likely to have the worst dimensional accuracy?
In addition to the random noise shrinkage, what other general factors affect dimensional accuracy in FF processes?
What are the patterning and layering mechanisms for stereolithography?
Why is the activity of prototyping so important?
What is hatching? What advantage is provided by investment casting hatch styles?
What are the two factors that lead to the parabolic shape of the voxel geometry in scanned laser photopolymerization processes?
Assuming everything else remained constant, what would happen to the line width and line depth of a voxel if the power were decreased? If the scanning speed were decreased?
What are the advantages of SLP processes? Disadvantages?
What are the patterning and layering mechanisms for solid ground curing?
What type of postprocessing is required for lamp photopoly-merization processes?
What are the advantages of lamp photopolymerization processes? Disadvantages?
Why is the activity of rapid prototyping so expensive?
What are the patterning and layering mechanisms for fused deposition modeling?
What are the advantages of ED processes? Disadvantages?
What are the patterning and layering mechanisms for inkjet deposition processes?
What type of postprocessing is required for ID processes?
What are the advantages of ID processes? Disadvantages?
What are the patterning and layering mechanisms for selective laser sintering?
What type of postprocessing is required for SLFS processes?
What are the advantages of SLFS processes? Disadvantages?
What is the difference between fusing and sintering?
How is the processing of metal and ceramic powder different from the processing of thermoplastic powder in SLFS processes?
What are the patterning and layering mechanisms for selective inkjet binding processes?
What type of postprocessing is required for SIB processes?
What are the advantages of SIB processes? Disadvantages?
What are the patterning and layering mechanisms for lamination-based processes?
What are the advantages of lamination-based processes? Disadvantages?
What is rapid tooling? Why is it such a good match for FF technology?
Name three different types of rapid tooling. Briefly describe each.
What are engineering tooling assemblies (ETAs)? Why are ETAs significant?
List five other names that are often used synonymously to describe rapid prototyping technology. For each name, provide a rationale or draw a parallel for why the name is used.
List several applications that FF technology can be used for.
What three steps used in the general sequence are common to all FF processes?
What is meant by the statement that FF processes are additive?
What are the four classifications of FF processes?
Figure CS-33 shows a 5|in. diameter flywheel for use in a large, commercial-grade high-speed computer printer. The part is 3| in. thick to provide a total weight of approximately 12 lb, assuming
What is a p-n junction? What can it be used for?
What is the barrier potential of a p-n junction? Why does it exist?
List the sequence of steps necessary to produce a bipolar diode.
Why are notches or flats cut or ground along the periphery of the single-crystal ingot?
Why are single-crystal ingots with diameters 300 mm and larger marked with a notch instead of a flat?
What are some geometric concerns involved with wafer production?
What are the major advantages of integrated circuits over electronic assemblies? What is the advantage of electronic assemblies?
What does gettering mean in relation to wafer production?
Name three methods for doping a silicon wafer.
What are some advantages of ion implantation over thermal diffusion?
Why must ion-implanted substrates be annealed?
Why are rapid thermal processing technologies generally advantageous?
What are two ways in which silicon dioxide is commonly used in microelectronic manufacturing?
Give two reasons why wet oxidation is better suited to making thicker oxides (e.g., diffusion masks) than dry oxidation.
How is the lateral geometry of the IC and its components patterned into microelectronic materials?
In addition to photolithography, name three other lithographic methods that may be used for pattern transfer.
How many levels of electronic manufacturing exist? Name each level.

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