Question: A thin electronic component with a surface area of 950 cm 2 is cooled by having a heat sink attached on its top surface. The

A thin electronic component with a surface area of 950 cm² is cooled by having a heat sink attached on its top surface. The thermal contact conductance of the interface between the electronic component and the heat sink is 25,000 W/m²∙K. According to the manufacturer, the heat sink has combined convection and radiation thermal resistance of 1.3 K/W. If the electronic component dissipates 45 W of heat through the heat sink in a surrounding temperature of 30°C, determine the temperature of the electronic component. Does the contact resistance at the interface of the electronic component and the heat sink play a significant role in the heat dissipation?

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