In a manufacturing plant, 100 mm by 40 mm thin rectangular electronic devices are assembled in mass

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In a manufacturing plant, 100 mm by 40 mm thin rectangular electronic devices are assembled in mass quantity. The top surface of the electronic device is made of aluminum and is attached with a HS 5030 aluminum heat sink positioned horizontally. The electronic device dissipates 45 W of heat through the heat sink. Both aluminum surfaces have a roughness of about 10 mm and an average interface pressure of 1 atm. To prevent the electronic device from overheating, the top surface temperature should be kept below 85°C in an ambient surrounding of 30°C. Your task as a product engineer is to ensure that the heat sink attached on the device’s top surface is capable to keep the device from overheating. Determine whether or not the top surface temperature of the electronic device, with a HS 5030 heat sink attached on it, is higher than 85°C. If so, what action can be taken to reduce the surface temperature to below 85°C? Since your company has a vast quantity of the HS 5030 heat sinks in the inventory, replacing the heat sinks with more effective ones is too costly and is not a viable solution.

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