A carbon/epoxy lamina is clamped between rigid plates in a mold (see figure below) while curing...

 

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A carbon/epoxy lamina is clamped between rigid plates in a mold (see figure below) while curing at a temperature of 125°C. After curing, the lamina/mold assembly (still clamped together) is cooled from 125°C to 25°C. The cooling process occurs in moist air and the lamina absorbs 0.5% of its weight in moisture. The lamina has the following properties: Ej = 140 GPa, E2 = 10 GPa, G12 = 7.0 GPa, v12 = 0.3 a1 = -0.3 x 10* /°C, az = 28 x 10 °C, Bi=0, B2=0.44 Assuming that the lamina properites do not change over this temperature range and that the lamina is initially dry and stress free, determine the residual hygrothermal stresses in the lamina at 25°C for angles 0 = 0° and 45°. Rigid plate Lamina Rigid plate A carbon/epoxy lamina is clamped between rigid plates in a mold (see figure below) while curing at a temperature of 125°C. After curing, the lamina/mold assembly (still clamped together) is cooled from 125°C to 25°C. The cooling process occurs in moist air and the lamina absorbs 0.5% of its weight in moisture. The lamina has the following properties: Ej = 140 GPa, E2 = 10 GPa, G12 = 7.0 GPa, v12 = 0.3 a1 = -0.3 x 10* /°C, az = 28 x 10 °C, Bi=0, B2=0.44 Assuming that the lamina properites do not change over this temperature range and that the lamina is initially dry and stress free, determine the residual hygrothermal stresses in the lamina at 25°C for angles 0 = 0° and 45°. Rigid plate Lamina Rigid plate

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Ansulev Given Temparatuv e To 128 I 140 GPa 03 x 10e E l0GPa 0 B 0 Ge 7GPA R 044 ... View the full answer