Question: CENG324: Digital System Design Homework #1 Due 10/3/2019 Spring 2019 1 Discuss the tradeoffs between the various technologies available for implementing an integrated circuits. (ASIC,

CENG324: Digital System Design Homework #1 Due 10/3/2019 Spring 2019 1

CENG324: Digital System Design Homework #1 Due 10/3/2019 Spring 2019 1 Discuss the tradeoffs between the various technologies available for implementing an integrated circuits. (ASIC, PLDs, CPLD and FPGAs) 2. Discuss the tradeoffs between schematic-based design and HDL-based design Discuss the advantages of using Electronic Design Automation tools in the hardware design flow 3. 4. Briefly explain what is meant by top-down and bottom-up design methodologies 5. Briefly explain the differences between the three types of PLDS (ROM, PLA and PAL)

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