Determine the direct fabrication cost of an integrated circuit that is 150 mils on a side in size. Assume a wafer-fab cost of $130.00, a package and testing cost of $0.40, a die-fab yield of 0.8, and a final test yield of 0.8. Work the problem for yield curves A,B, andC in Fig. 2.68. Assume a 4-inch wafer.

Fig. 2.68

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100 80 60 40 t--- Process A 10 8. 6. Process B Process C 10 20 30 40 50 60 70 80 90 100 Die size (mi? x 10) 4) 2. Yws (yield, %)