Question: Q1. A TiWh layer is deposited on a substrate using a sputtering tool. Table contains layer thickness measurements (in Angstroms) on 20 subgroups of four

Q1. A TiWh layer is deposited on a substrate using a

Q1. A TiWh layer is deposited on a substrate using a sputtering tool. Table contains layer thickness measurements (in Angstroms) on 20 subgroups of four substrates. (a) Set up and R control charts on this process. Is the process in control? Revise the control limits as necessary. (b) Estimate the mean and standard deviation of the process. (c) If the specifications are at 45030, estimate fraction defectives

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