Question: Problem 2 (30 points) A TiW layer is deposited on a substrate using a sputtering tool. The following table contains layer thickness measurements (in Angstroms)

Problem 2 (30 points) A TiW layer is deposited on

Problem 2 (30 points) A TiW layer is deposited on a substrate using a sputtering tool. The following table contains layer thickness measurements (in Angstroms) on 12 subgroups of four substrates. (a) Set up X and R control charts on this process. Is the process in control? Revise the control limits as necessary. (b) Estimate the mean and standard deviation of the process. (c) If the specifications are at 450+30, estimate the process capability ratio Cp. (d) What's the defective rate the process is producing or how much is process fallout of the specification limits? (e) What's ARL for this process and what's ATS if the sampling frequency is 2 hours? And I=? Subgroup .X1 .X2 X3 X4 449 1 2. 3 4. 5 6 7 8 459 443 457 469 443 444 445 446 444 432 445 456 440 444 463 457 456 449 455 452 463 452 457 435 442 449 453 445 456 450 449 457 463 453 436 450 442 444 438 454 457 445 452 440 443 438 457 9 10 11 12

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